Okuma Announces Manufacturing Technology Agreement with SAP America, Inc.
Okuma America Corporation and Partners in THINC have announced an agreement with SAP America, Inc. that merges the technology of the power of THINC with the SAP® Manufacturing Integration and Intelligence (SAP MII) application to create a seamless solution for end users. The agreement allows manufactures to achieve the ?perfect plant? in real time by merging business and manufacturing systems together to reduce operating costs, increase returns on asset usage, achieve compliance and quality standards, and meet the internal and external needs of their customers.
SAP had already recognized the pressures manufacturers faced on a daily basis and created the SAP MII product to connect the SAP ERP application to the plant floor in real time and deliver actionable intelligence to production personnel. The comprehensive solution provides both manufacturing intelligence and integration, extending the functionality of the SAP NetWeaver® technology platform onto the real-time plant floor to significantly lower the total cost of ownership on manufacturing systems infrastructure. Microsoft Windows compatible, the SAP software can be installed on THe Intelligent Numeric Control (THINC) to bring the power of SAP solutions directly to Okuma users.
?The handcuffs are off,? said Okuma President and COO Larry Schwartz. ?There are no limitations to the thinking of how to use the power of SAP business solutions or the power of third- and fourth-party hardware and software through the Okuma THINC control. This agreement allows the customer to generate real-time, timely data to improve their efficiencies, and gain a competitive advantage – from the shop floor to the boardroom.?
The THINC control is the central force behind Partners in THINC, located in Charlotte, North Carolina. The facility features partnerships from more than 30 industry leaders who work together to provide real-world, integrated manufacturing solutions for the Okuma end-user. Members of Partners in THINC integrate their equipment and software solutions through the plug-and-play capable, Ethernet-ready THINC control to streamline manufacturing operations, cutting time and costs in the process. As a new partner of Okuma, SAP will be able to integrate directly with the THINC control instead of relying on a stand-alone computer to provide the necessary link.
?The addition of an Okuma THINC connector for use with SAP MII added to the already numerous prebuilt, standards-compliant connectors will allow more customers to attain SAP?s vision of the perfect plant,? said Grant Bodley, vice president, Discrete Industries, SAP America. ?This will help bring together core SAP solutions with the software, hardware and services offerings of ecosystem partners to drive innovation for discrete manufacturers.?
Schwartz is confident that the advanced technology that Okuma has developed and the vast knowledge and experience that SAP brings to the table will be of great benefit to manufacturing customers.
?Our companies will now, for the first time, bring the two worlds together and providing the manufacturing arena and the business arena real-time, timely information ? information they can act and improve upon,? Schwartz said.
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